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Technical Papers

2015
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2012
2011
2010
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2005
Application
Date Title Conference
2011-12-06 N-Sinker formation by Phosphorous Silicon Glass Diffusion 14th Annual
2011-12-06 Power Electronics System Thermal Design APEC 2011 - U.S
2011-12-06 Application of Work Sampling and ECRS (Eliminate, Combine, Re-lay out and Simplify) ASEMEP National Technical Symposium (Philippines)
2011-12-06 Eliminating a Polysilicon hole defect created during oxide removal ASMC: 16-18 May 2011 at the Saratoga Springs, New York.
2011-12-06 Capacitive behaviour in Super Junction Trench MOSFET devices Conference on Device Electronics (CDE), Palma, Spain
2011-12-06 Use of Harsh Wire Bonding to Evaluate Various Bond Pad Structures EMPC IMAPS Europe confrence on Microelectronics
2011-12-06 Physically Robust Interconnect Design in CUP Bond Pads IMAPS / SEMI ATW on Wire Bonding
2011-12-06 Optimization of ONBCD25 Depletion-Mode NLDMOS24V5V Device ISPSD 2011 (San Diego, USA)
2011-12-06 Extremely Lightweight X-Ray Optics Based on Thin Substrates SPIE Conference 8076, EUV and X-ray Optics: Synergy between Laboratory and Space/Prague
2011-12-06 Use of Harsh Wafer Probing to Evaluate Various Bond Pad Structures SWTC, Semiconductor Wafer Test Workshop, San Diego, CA, USA
2011-12-06 Free-charge carrier profile of iso- and aniso-type Si homojunctions determined by terahertz and mid-infrared ellipsometry Thin Solid Films