安森美半导体发布2014年第2季度业绩
2014年第2季度业绩摘要:
• 总收入约7.576亿美元
• 公认会计原则(GAAP)毛利率为36.0%
• 非公认会计原则(Non-GAAP)毛利率为36.2%
• GAAP每股摊薄净收入为0.20美元
• Non-GAAP每股摊薄净收入为0.20美元
2014年7月31日 – 推动高能效创新的安森美半导体公司(ON Semiconductor Corporation,美国纳斯达克上市代号:ONNN)今日美国时间宣布,2014年第2季度的总收入为7.576亿美元,比2014年第1季度上升约7.2%。于2014年第2季度,公司录得GAAP净收入8,800万美元,相当于每股摊薄股份0.20美元。2014年第2季度GAAP净收入受到约170万美元的特别项目的负面影响。有关特别项目的全部详情载于附表。
2014年第2季度的Non-GAAP净收入为8,970万美元,相当于每股摊薄股份0.20美元,2014年第1季度则为7,520万美元,相当于每股摊薄股份0.17美元。此等Non-GAAP财务指标(及本新闻稿内所采用的其他Non-GAAP指标)与公司根据美国GAAP编制的最直接可比指标的对账,已载于附表及上载于公司网站http://www.onsemi.cn。此外,按终端应用巿场、区域、分销渠道及产品部划分的收入以及股份数目见于公司网站「投资者」网页。
以混合调整基础计算,安森美半导体于2014年第2季度的平均售价较2014年第1季下降稍多于1%。公司第2季度的GAAP总毛利率为36.0%及公司第2季度的Non-GAAP总毛利率为36.2%。2014年第2季度的GAAP营运毛利率为10.8%,而Non-GAAP营运毛利率则为13.4%。
2014年第2季度经调整EBITDA为1.465亿美元。2014年第1季度经调整EBITDA则为1.310亿美元。
安森美半导体总裁兼首席执行官傑克信(Keith Jackson)说:“公司在第2季录得强劲的收入增长及毛利率扩大,清楚显示我们在主要市场的势头及营运表现的改善。公司专注于汽车、工业及智能手机终端应用市场的策略正取得成果。2014年上半年,来自该等市场的收入占公司总收入约65%,按年增长超过10%,远超越原订中至高单位数的全年增长目标。”
傑克信说:“收入增长,加上成本结构优化及先前宣布采取的重组措施的额外增益,应可在日后为公司产生强劲的营运杠杆作用。我们近期收购的Truesense、尚待完成的Aptina Imaging收购,以及近期宣布与富士通半导体的晶圆代工合作,使公司准备就绪,迎来收入及盈利的进一步增长。”
2014年第3季度展望
傑克信说:“按现时产品订单趋势、未完成订单水平和估计周转水平,公司预计安森美半导体2014年第3季度的总收入将为约7.65亿美元至7.95亿美元。2014年第3季度的未完成订单水平相当于我们对2014年第3季度的预期收入约80%至85%。与2014年第2季度相比,2014年第3季度的平均售价预期将下降约1%至2%。2014年第3季度的展望包括以股票支付报酬支出约1,100万美元至1,300万美元。2014年第3季的业绩指引并不包括有待完成的Aptina, Inc.收购的任何收益贡献。”
下表概列安森美半导体2014年第3季度的GAAP及Non-GAAP展望。
安森美半导体2014年第3季业务展望 |
| |
安森美半导体GAAP总额 |
特别项目*** |
安森美半导体Non-GAAP总额**** |
| 收入 |
7.65亿美元至7.95亿美元 |
|
7.65亿美元至7.95亿美元 |
| 毛利率 |
35.6% 至37.6% |
200万美元至300 万美元 |
35.9%至37.9% |
| 运营支出 |
1.84亿美元至1.96亿美元 |
1,400万美元至1,600万美元 |
1.70亿美元至1.80亿美元 |
| 净利息支出/其它支出 |
700万美元至900万美元 |
|
700万美元至900万美元 |
| 可换股票据,非现金利息支出* |
200万美元 |
200万美元 |
0美元 |
| 税项 |
850万美元至1,150万美元 |
200万美元至300万美元 |
650万美元至850万美元 |
| 摊薄股数** |
4.44亿美元 |
|
4.44亿美元 |
* 可换股票据,非现金利息支出乃根据财务会计准则委员会(FASB)颁布的会计准则汇编(ASC)第470项:债务汇编计算
** 摊薄股份数目可因下列事项而出现变动,其中包括实际行使购股权或受限制股份单位、公司所有可换股高级后偿票据产生的摊薄股份增加、及回购或发行股份或可换股票据或出售库存股份。
*** 特别项目包括:无形资产摊销、与收购有关的无形资产摊销、评定存货公平市值支出增加、库存估值调整、购入在进行中的研发支出、重组、资产减值及其他净额商誉减值、债务预付收益与损失、非现金利息支出、近似现金所得税调整、退休金计划及其他退休福利的精算(收益)亏损,以及若干其他适用的特别项目。
**** G规例及其他证券法的法规规定了并非按GAAP编制的财务计量的用途。我们认为,此等Non-GAAP计量可为投资者提供重要的补充资料。我们利用此等计量连同GAAP计量作内部管理用途,并作为评估期间与期间比较数据的方式。然而,我们并不,而阁下也不应,全然依赖Non-GAAP计量作为业绩表现的衡量基准。我们认为,Non-GAAP财务计量是反映我们业务运营的特点的另一方式,当连同GAAP业绩及我们同时发布的与相应GAAP财务计量的对账一并采纳时,可使阁下对影响我们业务的因素及趋势有更完整的理解。由于Non-GAAP财务计量并未标准化,故可能无法将此等财务计量与其他公司的Non-GAAP财务计量相比较(即使在项目名称相同的情况下,亦无法比较)。
FINANCIALS
TELECONFERENCE
ON Semiconductor will host a conference call for the financial community at 5:00 p.m. Eastern Daylight Time (EDT) on July 31, 2014 to discuss this announcement and ON Semiconductor’s results for the second quarter of 2014. The company will also provide a real-time audio webcast of the teleconference on the Investors page of its website at http://www.onsemi.com. The webcast replay will be available at this site approximately one hour following the live broadcast and will continue to be available for approximately 30 days following the conference call. Investors and interested parties can also access the conference call through a telephone call by dialing (888) 291-2604 (U.S./Canada) or (760) 536-5202 (International). In order to join this conference call, you will be required to provide the Conference ID Number - which is 30869557. Approximately two hours following the live broadcast, the company will provide a dial-in replay that will continue to be available through September 1, 2014. To listen to the teleconference replay, call (855) 859-2056 (U.S./Canada) or (404) 537-3406 (International). You will be required to provide the Conference ID Number.
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关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ONNN)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。公司全面的高能效电源和信号管理、逻辑、分立及定制方案阵容,帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、LED照明、医疗、军事/航空及电源应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问http://www.onsemi.cn。
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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。
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