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产品更改通知 搜寻结果

Part Number = LM293

产品变更通告#

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发行日期

类型

行动

20122 Capacity expansion for SOIC08 Copper Wire Products into ASE Kunshan, China 2013-07-04 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
20082 Copper wire bond for IC Micro 8 package 2013-05-08 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16710A Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled 2012-02-29 UPDATE NOTIFICATION View PDF
16710 Copper wire bond for Micro 8 package in Seremban, Malaysia 2011-09-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16678O IC D2PAK 3 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK 2011-07-15 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16571 Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines 2011-01-19 PRODUCT BULLETIN View PDF
16568 Capacity expansions for SOIC08 Copper Wire Products into STARS Microelectronics, Thailand 2011-01-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16486 DPAK Package Case Outline Standardization to match JEDEC and Industry 2010-06-09 PRODUCT BULLETIN View PDF
16452 1Q10 Product Discontinuance Notice 2010-04-14 PRODUCT DISCONTINUANCE View PDF
16396 IC D2PAK 3 AND 5 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK 2010-02-12 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16227 Copper Wire in SOIC and TSSOP packaged Products 2009-05-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
16212 Move of IC T092 Assembly and Test to Dalian, China 2009-02-05 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16112 Move of IC T092 Assembly and Test to Dalian, China 2008-04-10 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16089 DPAK Package Mold Compound Change – Analog 2008-01-03 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16041 DPAK Package Mold Compound Change 2007-08-30 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16004 H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2007-06-27 PRODUCT DISCONTINUANCE View PDF
15550 FINAL NOTICE FOR IC T0220 PACKAGE CHANGE TO SINGLE GAGE HEATSINK 2006-05-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15505 Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion 2006-04-06 UPDATE NOTIFICATION View PDF
15339 Initial notice of intent to qualify Hana Semiconductor for Micro08, Micro10, and TSOP5 capacity expansion 2006-03-28 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15212 Pb-free Conversion - Backward Compatibility 2005-12-28 GENERAL ANNOUNCEMENT View PDF
15121 Final Change Notification OP AMP and Comparator Process Enhancement at CZ4 2005-12-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15018 Initial notice for IC T0220 package change to Single Gage heatsink 2005-09-15 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13848 OP AMP and Comparator Process Enhancement at CZ4 2004-12-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13701 Leadform T0220 Assembly Transfer to SBN from Tesla 2004-10-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13564 Qualification of D2PAK Packages at ON Semi Seremban 2004-08-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13462 Qualification of T0220 Packages at ON Semi Seremban 2004-05-06 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13276 Qualification of T0220 and D2PAK Packages at ON Semi Seremban 2003-12-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
12816 Qualification of Modified Leadframe Design for Analog 3 Lead D2PAK Package 2003-07-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11945 3ld Dpak Single Gauge Leadframe Qual at Internal and External 2001-10-09 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11785 Analog Device End Of Life Notice - BMC Shutdown 2001-09-27 PRODUCT DISCONTINUANCE View PDF
11703 T0220 and D2pak 5 Lead Change to Copper Wirebond 2001-08-28 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10147 Update Notification for PCNs 4813 and 10041 2000-03-08 UPDATE NOTIFICATION View PDF
10141 Addendum to PCN#10135: Assembly/Test Site Change from Motorola KLM to Tesla Seznam, Czech Republic 2000-02-15 UPDATE NOTIFICATION View PDF
10135 Assembly/Test Site Change from Motorola KLM to Tesla Seznam, Czech Republic 2000-02-10 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10044 Transfer from BMC/BP4 to Tesla of Analog Devices 1999-09-17 UPDATE NOTIFICATION View PDF
4958 Transfer of 3 Lead Surface Mount (D2T) Package to Tesla 1999-07-30 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4813 Transfer from BMC/BP4 to Tesla of Analog Devices 1999-06-18 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4529 Addendum to PCN#4396:Assembly/Test Site Change to Seremban, Malaysia 1999-03-12 PRODUCT BULLETIN View PDF
4436 Analog IC DPACK Assembly/Site Qualification for PSI Phillipines 1999-02-09 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4323 EOL for Various Analog Devices 1999-02-08 PRODUCT DISCONTINUANCE View PDF
4396 Assembly/Test Site Change to Seremban, Malaysia 1999-01-21 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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