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产品更改通知 搜寻结果

Part Number = MC10E155

产品变更通告#

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16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16164 Addition of PLCC20 / 28 package assembly capabilities at Amkor Technology Philippines (P1) Inc. package assembly site 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16126 Addition of PLCC20 / 28 package assembly capabilities at Amkor Technology Philippines (P1) Inc. package assembly site 2008-06-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
12874 Initial Notification for MOSAIC3 Product Transfer to COM 1 2003-04-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12049 Update to IPCN#11369, Wafer Capacity Addition for MOSAIC3 Technology 2001-11-19 UPDATE NOTIFICATION View PDF
11369 Initial Notification for Wafer Capacity Addition for MOSAIC3 Technology 2001-04-18 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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