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产品更改通知 搜寻结果

Part Number = MC10SX1130

产品变更通告#

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发行日期

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16161 Update to the Final Notification for transfer of M35 and M5 products from COM1 wafer fab (Phoenix, AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2011-02-01 UPDATE NOTIFICATION View PDF
16210 2008 (Second Half 2008) Leaded Parts to Lead Free Parts Standard Conversion EOL & 2009-02-11 PRODUCT DISCONTINUANCE View PDF
13518 Wafer Fabrication Site Transfer for Selected Product Families to The Com1 Facility 2004-07-07 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12874 Initial Notification for MOSAIC3 Product Transfer to COM 1 2003-04-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12049 Update to IPCN#11369, Wafer Capacity Addition for MOSAIC3 Technology 2001-11-19 UPDATE NOTIFICATION View PDF
11369 Initial Notification for Wafer Capacity Addition for MOSAIC3 Technology 2001-04-18 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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