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Part Number = MC33762
| 20082 |
Copper wire bond for IC Micro 8 package |
2013-05-08 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16710A |
Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled |
2012-02-29 |
UPDATE NOTIFICATION |
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PDF |
| 16710 |
Copper wire bond for Micro 8 package in Seremban, Malaysia |
2011-09-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16004 |
H1 2007 (First HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2007-06-27 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15199 |
Pb Free (Lead Free) Part Number 16 Character Nomenclature Set-Up |
2005-12-21 |
PRODUCT BULLETIN |
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PDF |
| 10185 |
Update to PCN#10105: Micro 8 Package Material |
2000-06-05 |
UPDATE NOTIFICATION |
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PDF |
| 10105 |
Qualification of MICRO8 Package at ON Semi Seremban Location |
1999-12-22 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 10102 |
Transfer of Analog DBL Layer Metal EPI85/92 Devices from BP4 to Tesla |
1999-12-20 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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