| 20848 |
Capacity expansion for TSSOP14/16 Products into ASE Kunshan, China. |
2015-05-21 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 20301 |
4Q2013 Product Discontinuance Notice |
2013-12-20 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 20029 |
1Q2013 Product Discontinuance Notice |
2013-04-18 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16622B |
Capacity expansion for SOIC14-16 Copper Wire Products into ASE Kunshan, China |
2012-01-30 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16784 |
4Q2011 Product Discontinuance Notice |
2012-01-27 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16622 |
Initial notice of intent to qualify ASE Kunshan for SOIC 14/16 capacity expansion |
2011-04-07 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16569 |
4Q10 Product Discontinuance Notice |
2011-01-24 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16571 |
Shipping Tube change for SOIC Narrow Body (SOIC NB) devices and QSOP at ON Semiconductor Carmona, Philippines |
2011-01-19 |
PRODUCT BULLETIN |
View
PDF |
| 16538 |
Special Leaded Product Discontinuance Notice |
2010-11-23 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16300 |
Final Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To Tower Semiconductor Ltd. (Israel) |
2009-07-13 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16218 |
TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm |
2009-02-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16178 |
Initial Notification for Transfer of High Speed Logic Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to Tower Semiconductor Israel. |
2008-12-02 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 16140 |
H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-08-20 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 16022 |
Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes |
2007-07-26 |
PRODUCT BULLETIN |
View
PDF |
| 15667 |
Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages |
2006-10-31 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15621 |
Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages |
2006-07-31 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15511 |
FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN |
2006-04-17 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15333 |
Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL |
2006-02-01 |
UPDATE NOTIFICATION |
View
PDF |
| 15157 |
Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan |
2005-12-07 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 15006 |
Intrinsic Lead (Pb) Free Product Part Number Change |
2005-08-30 |
PRODUCT BULLETIN |
View
PDF |
| 14235 |
Marking Type Change from Ink to Laser at ASECL |
2005-07-29 |
PRODUCT BULLETIN |
View
PDF |
| 13248 |
Lead Free Products Marking Identification |
2003-12-05 |
PRODUCT BULLETIN |
View
PDF |
| 12274 |
Final Notification Of High Speed Logic Family Migration |
2002-06-17 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 12048 |
Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification |
2002-01-11 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 11137 |
1st Quarter 2001 Product Discontinuance Notification |
2001-04-02 |
PRODUCT DISCONTINUANCE |
View
PDF |
| 10152 |
Update Notification for PCN10130 |
2000-03-15 |
UPDATE NOTIFICATION |
View
PDF |
| 10130 |
Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual |
2000-02-02 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4887 |
14/16/20L TSSOP 3-Layer Pre-Plated Frames |
1999-07-28 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |
| 4423 |
TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc |
1999-02-07 |
PRODUCT/PROCESS CHANGE NOTIFICATION |
View
PDF |