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产品更改通知 搜寻结果

Part Number = MC74LCX138

产品变更通告#

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16725 3Q11 Product Discontinuance Notice 2011-09-30 PRODUCT DISCONTINUANCE View PDF
16569 4Q10 Product Discontinuance Notice 2011-01-24 PRODUCT DISCONTINUANCE View PDF
16218 TSSOP Tube Dimension change: Tube width from 6.858mm to 8.44mm and Pedestal height from 1.397mm to 1.55mm 2009-02-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16022 Use of winged type crimp design + rib for TSSOP4.4mm shipping tubes 2007-07-26 PRODUCT BULLETIN View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15006 Intrinsic Lead (Pb) Free Product Part Number Change 2005-08-30 PRODUCT BULLETIN View PDF
13886 Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products 2005-01-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13825 Addition of Tower Semiconductor Fab for Minigate, LCX, LVX, Analog Switch and VHC Logic Products 2004-11-19 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
13157 Addition of Tower Fab for Minigate, LCX, VHC, FST and Analog Switch Products 2003-10-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12434 Standard Components Low Sales Devices Product Discontinuance 2002-05-09 PRODUCT DISCONTINUANCE View PDF
12048 Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification 2002-01-11 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10770 Addition of Tower Semiconductor as a Qualified Wafer Fabrication Site 2001-03-14 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10111 Traceability Code Correction for PB 10100 2000-01-10 PRODUCT BULLETIN View PDF
10100 Date Code Format Change for MFP(SO EIAJ T2) 1999-12-19 PRODUCT BULLETIN View PDF
10104 Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products 1999-12-19 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10052 Deleting LCX Toshiba Die from Finish Goods Bill of Material 1999-10-25 PRODUCT BULLETIN View PDF
4887 14/16/20L TSSOP 3-Layer Pre-Plated Frames 1999-07-28 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4423 TSSOP14/16/20 Assembly and Test Site Transfer to Motorola Phillipines Inc 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4419 MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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