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产品更改通知

Change Notification #   20626
Revision   CB
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN for wire change from AU to CU, mold compound change & part number change
Issue Date   2014-12-26
Affected Product Family  
Description   This is a Final Process Change Notification to announce for below contents. 1) Changing wire material from gold to copper 2) Changing part number from XXXXXX-TL-H to XXXXXX-TL-W. (See the list of models)
Key Items Affected by Change   Assembly area- Wire Bonding and Mold compound and Part number change
 
Key Milestones  
Effective Date:   2015-04-02
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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