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产品更改通知 搜寻结果

Part Number = NCP2890

产品变更通告#

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16914 Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. 2012-10-05 PRODUCT BULLETIN View PDF
16121 Qualification of UAT for Bumped Products 2008-05-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16116 Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for Devices Currently Fabricated at XFAB Wafer Foundries 2008-05-13 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
16055 Capacity Expansion for Devices Fabricated at XFAB Wafer Foundries 2007-10-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15645 3rd QUARTER 2006 Product Discontinuance Notice 2006-10-06 PRODUCT DISCONTINUANCE View PDF
15505 Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion 2006-04-06 UPDATE NOTIFICATION View PDF
15385 Qualification of Hana Semiconductor for NCP2890DMR2, NCP2890DMR2G Micro-8 Assembly 2006-02-15 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15336 Initial Notification of Qualification of Advance Semiconductor Engineering (Site K7) for Flipchip Assembly 2006-02-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15031 Qualification of FlipChip International (FCI) for Bumped Products 2005-10-14 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13577 Qualification of XFAB Texas Wafer Fab for NCP2890A Micro-Bumped Devices 2004-08-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13554 Qualification of XFAB-Texas Wafer Fab for Additional Devices 2004-07-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13480 Qualification of XFAB Texas Wafer Fab for NCP2890A Micro-Bumped Devices 2004-05-28 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13436 Qualification of FLIPCHIP INTERNATIONAL (FCI) for Bumped Products. 2004-04-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
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