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产品更改通知 搜寻结果

Part Number = NCP2990

产品变更通告#

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发行日期

类型

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20695 4Q2014 Product Discontinuance Notice 2015-01-20 PRODUCT DISCONTINUANCE View PDF
16971 Qualification of Deca Philippines for Bump Post-Test Production (Wafer saw, visual inspection, Tape and Reel) 2013-02-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16914 Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. 2012-10-05 PRODUCT BULLETIN View PDF
16181 Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for NCP2990FCT2G 2008-11-25 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16121 Qualification of UAT for Bumped Products 2008-05-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16116 Capacity Expansion Qualification of ON Semiconductor Gresham Wafer Fab for Devices Currently Fabricated at XFAB Wafer Foundries 2008-05-13 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16055 Capacity Expansion for Devices Fabricated at XFAB Wafer Foundries 2007-10-01 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16045 Qualification of Flip Chip International (FCI) for Bumped Products 2007-09-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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