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Change Notification #   20346
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Installation of back grind production line in OSPI Carmona for products that get wafer probe and assembly operations in OSPI
Issue Date   2014-09-09
Affected Product Family  
Description   Products that currently get wafer probing and assembly in OSPI Carmona are shipped to a subcontractor for back grinding in between probing and assembly. By installing the back grind capacity in OSPI we will reduce the cycle time, create extra capacity for back grinding and improve the quality by eliminating the non-added value shipping steps.
Key Items Affected by Change   Backgrind
 
Key Milestones  
Effective Date:   2014-12-15
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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