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产品更改通知 搜寻结果

Part Number = NLAS4684

产品变更通告#

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发行日期

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行动

20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16914 Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. 2012-10-05 PRODUCT BULLETIN View PDF
16083 H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL 2008-01-03 PRODUCT DISCONTINUANCE View PDF
15505 Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion 2006-04-06 UPDATE NOTIFICATION View PDF
15336 Initial Notification of Qualification of Advance Semiconductor Engineering (Site K7) for Flipchip Assembly 2006-02-08 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15174 Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban 2005-12-14 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15021 Update Notification for QFN Assembly at NSEB 2005-09-19 UPDATE NOTIFICATION View PDF
15009 Final PCN for NLAS4684 ESD Redesign moving from 0.5u CMOS process to 0.6u in Tower 2005-08-26 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
14234 Initial PCN for NLAS4684 ESD Redesign Moving from 0.5u CMOS Process to 0.6u in Tower. 2005-07-15 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13751 Final PCN for Qualification of QFN (3.3MM TO 8X8MM, 6 TO 52-LD) at ASAT China 2004-12-02 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13716 Initial PCN for Qualification of QFN (2X2.2MM TO 8X8MM, 6 TO 52-LD) at ASAT China 2004-10-22 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13578 Final PCN for Qualification of QFN 3X3MM (10-LD) at NSEB 2004-08-24 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13511 Qualification of Flipchip International (FCI) for Bumped Products 2004-07-01 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13503 Final PCN for Qualification of QFN 3X3MM at ON Seremban, Malaysia 2004-06-11 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13436 Qualification of FLIPCHIP INTERNATIONAL (FCI) for Bumped Products. 2004-04-19 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13368 Qualification of 3X3 QFN (QUAD FLAT NO-LEAD) Package at NSEB 2004-03-12 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13296 Initial PCN for Qualification of QFN (2X2.2MM to 8X8MM, 6 to 52LD) at ON Seremban 2004-01-21 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13270 Initial PCN for Qualification of QFN (QUAD FLAT NO-LEAD) (2X2.2MM to 8X8MM, 6 to 52LD) at NSEB 2003-12-16 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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