| 20948X |
Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia |
2015-07-10 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16914 |
Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. |
2012-10-05 |
PRODUCT BULLETIN |
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PDF |
| 16083 |
H2 2007 (Second HALF 2007) Leaded Parts to Lead Free Parts standard conversion EOL |
2008-01-03 |
PRODUCT DISCONTINUANCE |
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PDF |
| 15505 |
Update to 15339: Initial notice of intent to qualify Hana Semi for Micro08, Micro10, and TSOP5 capacity expansion |
2006-04-06 |
UPDATE NOTIFICATION |
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PDF |
| 15336 |
Initial Notification of Qualification of Advance Semiconductor Engineering (Site K7) for Flipchip Assembly |
2006-02-08 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15174 |
Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban |
2005-12-14 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15021 |
Update Notification for QFN Assembly at NSEB |
2005-09-19 |
UPDATE NOTIFICATION |
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PDF |
| 15009 |
Final PCN for NLAS4684 ESD Redesign moving from 0.5u CMOS process to 0.6u in Tower |
2005-08-26 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 14234 |
Initial PCN for NLAS4684 ESD Redesign Moving from 0.5u CMOS Process to 0.6u in Tower. |
2005-07-15 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13751 |
Final PCN for Qualification of QFN (3.3MM TO 8X8MM, 6 TO 52-LD) at ASAT China |
2004-12-02 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13716 |
Initial PCN for Qualification of QFN (2X2.2MM TO 8X8MM, 6 TO 52-LD) at ASAT China |
2004-10-22 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13578 |
Final PCN for Qualification of QFN 3X3MM (10-LD) at NSEB |
2004-08-24 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13511 |
Qualification of Flipchip International (FCI) for Bumped Products |
2004-07-01 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13503 |
Final PCN for Qualification of QFN 3X3MM at ON Seremban, Malaysia |
2004-06-11 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13436 |
Qualification of FLIPCHIP INTERNATIONAL (FCI) for Bumped Products. |
2004-04-19 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13368 |
Qualification of 3X3 QFN (QUAD FLAT NO-LEAD) Package at NSEB |
2004-03-12 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13296 |
Initial PCN for Qualification of QFN (2X2.2MM to 8X8MM, 6 to 52LD) at ON Seremban |
2004-01-21 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 13270 |
Initial PCN for Qualification of QFN (QUAD FLAT NO-LEAD) (2X2.2MM to 8X8MM, 6 to 52LD) at NSEB |
2003-12-16 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |