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Part Number = NLAS5223
| 20286 |
NCP347, NCP348 & Other DFN/ QFN Devices (Gold Wire) Qualification at ASE-SH and AMKOR-Philippines Assembly Facilities. |
2013-10-30 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 20096 |
Assembly Qualification of uDFN and uQFN Analog Switch Family at ATP3 for expansion. |
2013-06-28 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16452 |
1Q10 Product Discontinuance Notice |
2010-04-14 |
PRODUCT DISCONTINUANCE |
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PDF |
| 16151 |
Final Notification of Qualification of Gresham Wafer Fab for NLAS5223BMNR2G and NLAS5223BMUR2G |
2008-09-23 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16034 |
FPCN for Qualification of UDFN/UQFN 0.5mm Package Thickness (1.0x1.2mm to 1.8x2.6mm) at ON Seremban |
2007-08-24 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 16007O |
FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness |
2007-04-06 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15676 |
Initial PCN for Qualification of UQFN / UDFN / LLGA 0.5mm package thickness 1x1mm to 3x3mm) at ON Seremban |
2006-12-06 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15665 |
Final PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, |
2006-10-27 |
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
| 15174 |
Initial PCN for Qualification of QFN 0.75 mm package thickness (1.2 x 1mm to 8x8mm, 6 to 52LD) at ON Seremban |
2005-12-14 |
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
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PDF |
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