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Change Notification #   20790
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   T3 WDFN Dual Copper Wire Conversion in SBN
Issue Date   2015-02-24
Affected Product Family  
Description   ON Semiconductor has qualified 2.0 mil copper wire bonding on WDFN3030 8L T3 technologies. Copper wire exhibits significantly better conductivity than gold or aluminum, enabling better heat dissipation and increased power ratings. Intermetallic growth in copper bonds is significantly slower than in gold wire bonds. This results in lower electrical resistance, lower heat generation and, ultimately, increased bond reliability and device performance. This is important for high temperature application.
Key Items Affected by Change   Material Change
 
Key Milestones  
Effective Date:   2015-05-29
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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