产品更改通知
| Change Notification # |
|
20790 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
T3 WDFN Dual Copper Wire Conversion in SBN |
| Issue Date |
|
2015-02-24 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor has qualified 2.0 mil copper wire bonding on WDFN3030 8L T3 technologies.
Copper wire exhibits significantly better conductivity than gold or aluminum, enabling better heat dissipation and increased power ratings.
Intermetallic growth in copper bonds is significantly slower than in gold wire bonds. This results in lower electrical resistance, lower heat generation and, ultimately, increased bond reliability and device performance. This is important for high temperature application.
|
| Key Items Affected by Change |
|
Material Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2015-05-29 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|