产品更改通知
| Change Notification # |
|
10049 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualify Case-77 Plateless Leadframe and Process |
| Issue Date |
|
1999-10-13 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
As part of the cost containment Programs for ON Semiconductor, SCG Seremban has qualified and will be converting the CASE-77 package to a plateless leadframe process. Devices built with the plateless leadframe have completed all internal Reliability qualification requirements per the AEC guidelines and is available upon request.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2000-01-20 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office. |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|