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产品更改通知

Change Notification #   10123
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   SOT223 Epoxy Die Attach
Issue Date   2000-01-26
Affected Product Family   DISCRETES AND LOGIC
Description   Small Signal SOT223 product with die sizes of 32x32 mils and larger will convert from a Eutectic Die Attach process to an Epoxy Die Attach process enhancing product quality during board mount assembly. As a part of the design improvement, the SOT223 leadframe is being modified to add additional mold lock features, and the wafer back metal process is converted from a Sinter process to an Alloy process.
Key Items Affected by Change   Assembly Process Wafer Process
 
Key Milestones  
Effective Date:   2000-03-26
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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