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Change Notification #   10130
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual
Issue Date   2000-02-02
Affected Product Family   DISCRETES AND LOGIC
Description   Currently ON Semiconductor SOIC products are being assembled at multiple assembly locations using either Sn-Pb or 2 layer (NiPd) pre-plated frames. ON Semiconductor at Carmona, Philippines has qualified 3-layer (Ni-Pd-Au) pre-plated lead frames for SOIC 8/14/16 lead packages and will be converted to the 3 layer system. This change is being implemented to consolidate multiple assembly processes. ON Semiconductor at Carmona, Philippines has been using the 3 layer pre-plated frames on TSSOP packages since November 1999. This additional change in SOIC packages is an incremental step toward the worldwide reduction of Pb in manufacturing. Upon expiration of this PCN, due to the multiple assembly locations for SOIC products, customers may receive products with any of the three systems. These are the Sn-Pb, 2 layer Ni-Pd or the 3 layer Ni-Pd-Au systems. All of the required reliability testing has been completed with satisfactory results.
Key Items Affected by Change   On Semiconductor Assembly Site
 
Key Milestones  
Effective Date:   2000-05-12
Sample Info:   See Process Change Notification
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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