产品更改通知
| Change Notification # |
|
10180 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
48LD TSSOP 3-Layer Pre-Plated Lead Frame |
| Issue Date |
|
2000-04-27 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
Since November 1999, ON Semiconductor has been building 14/16/20LD TSSOP using 3-layer (Ni-Pd-Au) pre-plated lead frames in Carmona Philipines. Carmona has recently qualified the 48LD TSSOP package using the 3-layer (Ni-Pd-Au) pre-preplated frames. This change is being implemented to expand assembly capacity to provide enhanced customer support. Upon expiration of this PCN, customers may receive 48ld TSSOP products with either of these 2 processes: Sn-Pb finish or 3-layer Ni-Pd-Au.
|
| Key Items Affected by Change |
|
Package Change, On Semiconductor Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2000-08-05 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office. |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|