产品更改通知
| Change Notification # |
|
11634 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Assembly Site Qualification for TSSOP24 lds |
| Issue Date |
|
2001-08-14 |
| Affected Product Family |
|
LOGIC |
| Description |
|
ON Semiconductor is pleased to announce that it will be expanding its assembly capacity by qualifying the ON Semiconductor Philippines Incorporated (OSPI) facility located in Carmona, Philippines to assemble selected Logic products in TSSOP24 packages. Currently, TSSOP24 lds packages are assembled in Amkor Korea (ATK4) & AIT Indonesia, and are tested at ON Semiconductor Philippines Incorporated (OSPI). ON Semiconductor's OSPI facility has been producing high quality SOIC, PLCC and TSSOP products for over 8 years. The OSPI facility is certified to QS-9000 and ISO-9001:1994 standards. There will be no change in device functionality. Device parameters will continue to meet all Data Book specifications, and reliability will continue to meet or exceed ON Semiconductor standards.
|
| Key Items Affected by Change |
|
Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2001-10-13 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|