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Change Notification #   12048
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification
Issue Date   2002-01-11
Affected Product Family   LOGIC
Description   This is the Final Notification for Initial Notification #12048 that went out on 14-Nov-2001. Au wire qualification at assembly to include reduced diameter 0.8 mil wire in addition to the standard 0.98 mil diameter wire for all SOIC and TSSOP Logic device types. This additional 0.8-mil in diameter will be done in anticipation of fine-pitch devices that will be entering production. All SOIC and TSSOP Logic device types, which are currently using the 0.98-mil Au wire, will be affected by this change which will be implemented in several phases.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2002-03-22
Sample Info:   Yes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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