产品更改通知
| Change Notification # |
|
13024 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Assembly/Test Site Capacity Addition for Clock and Data Management Products in the 8 Lead SOIC Narrow Body Package |
| Issue Date |
|
2003-08-27 |
| Affected Product Family |
|
BROADBAND |
| Description |
|
ON Semiconductor is pleased to announce that it has successfully completed qualification of the ON Semiconductor Philippines Incorporated (OSPI) facility located in Carmona, Philippines to assemble and test the listed Clock and Data Management products in 8 lead narrow body SOIC packages. This FPCN is in addition to devices qualified under FPCN 11507 located at www.onsemi.com.
|
| Key Items Affected by Change |
|
Assembly/Test Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2003-10-27 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|