产品更改通知
| Change Notification # |
|
15507 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of OSPI for Assembly/Test of 8/14/16 Lead SOIC Narrow Packages |
| Issue Date |
|
2006-04-11 |
| Affected Product Family |
|
ANALOG |
| Description |
|
Final Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8/14/16 lead narrow SOIC packages. The devices listed on this FPCN have historically been assembled/tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Initial PCN and subsequent Final PCN, these devices may be processed at either location. The ON Semiconductor facility at Carmona, Philippines is fully qualified and has been producing the SOIC narrow body products for many years. The capacity expansion will involve duplication of the existing equipment set currently in production.
Please refer to Initial PCN notice number 15335 and Update Notice 15453 which are both related to this change.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly and Test |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-06-11 |
| Sample Info: |
|
Contact your local sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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