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产品更改通知

Change Notification #   15667
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages
Issue Date   2006-10-31
Affected Product Family   ALL
Description   This is the Final Process Change Notice to IPCN 15621available at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/24/28 lead Wide body SOIC packages.
Key Items Affected by Change   Assembly and test site change
 
Key Milestones  
Effective Date:   2006-12-31
Sample Info:   contact local sales office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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