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产品更改通知

Change Notification #   16007
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN for Qualification of QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness
Issue Date   2007-04-06
Affected Product Family  
Description   Upon expiration of this FPCN, all QFN/DFN (1.6x1.6MM to 8.0x8.0MM) on 0.90mm thickness devices and all WDFN/WQFN 0.75MM Package Thickness (1.2x1.0MM to 8.0x8.0MM) devices will be sourced from both the Seremban facility and the existing facility (UTAC, located in Bangkok, Thailand).
Key Items Affected by Change   Package thickness
 
Key Milestones  
Effective Date:   2007-06-06
Sample Info:   contact local sales office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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