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Change Notification #   16034
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN for Qualification of UDFN/UQFN 0.5mm Package Thickness (1.0x1.2mm to 1.8x2.6mm) at ON Seremban
Issue Date   2007-08-24
Affected Product Family  
Description   This is a Final PCN (Product Change Notice) to notify customers that the changes described in PCN#15676 (which can be found at www.onsemi.com), have been completed for the listed devices. This is the Final PCN announcing the qualification of the ON Semiconductor facility located in Seremban, Malaysia as an additional assembly location for the 0.5mmthickness UQFN/UDFN packages for analog switches. Seremban is currently a qualified site for the assembly of 0.9mm thick QFN/DFN packages. There will be no changes in device functionality, case outline, or footprint. Reliability will continue to meet or exceed ON Semiconductor’s highest standards. Upon expiration of this FPCN, all UDFN/UQFN 0.5MM Package Thickness (1.0x1.2 MM to 1.8x2.6MM) devices will be sourced from both the Seremban facility and the existing facility (UTAC, located in Bangkok, Thailand). Any new devices/derivatives package from same qfn platform released after publication of this Generic FPCN for a specific package style/die size will be qualified for assembly in both locations.
Key Items Affected by Change   ON Semiconductor Assembly & Test
 
Key Milestones  
Effective Date:   2007-11-24
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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