产品更改通知
| Change Notification # |
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16055 |
| Revision |
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| Type of Notification |
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INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Capacity Expansion for Devices Fabricated at XFAB Wafer Foundries |
| Issue Date |
|
2007-10-01 |
| Affected Product Family |
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| Description |
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ON Semiconductor is pleased to announce a general capacity expansion qualification for devices fabricated at the XFAB wafer foundries. XFAB is a sub-contract wafer fab company currently providing wafer manufacturing services to ON Semiconductor at facilities in Erfurt, Germany and Lubbock, TX (USA).
This is an Initial PCN announcing ON Semiconductor’s intention to expand manufacturing capacity and improve manufacturing flexibility by qualifying products at one or more of the XFAB facilities, including a third XFAB facility located in Kuching, Malaysia. All XFAB facilities are certified ISO9001:2000 compliant. XFAB offers the same process technology in all three fab locations; therefore, no die design changes are anticipated. Device performance will be the same among the qualified facilities for each device family. All devices will continue to be assembled and tested in existing, qualified locations. No changes to packaging will occur as a result of this foundry expansion qualification.
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| Key Items Affected by Change |
|
Subcontractor Fab Site |
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| Key Milestones |
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| Effective Date: |
|
2007-02-01 |
| Sample Info: |
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| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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