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产品更改通知

Change Notification #   16080
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   FPCN SOIC WB EXPANSION FOR OSPI
Issue Date   2007-12-18
Affected Product Family  
Description   This is one of multiple Final Process Change Notices to IPCN 15621 available at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/24/28 lead Wide body SOIC packages. The devices listed on this FPCN have historically been assembled/tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Final PCN, these devices may be processed at either location. This is not a transfer but a capacity expansion. Devices will be qualified in phases with only those devices listed below affected by this FPCN.
Key Items Affected by Change   On Semi Assembly and Test
 
Key Milestones  
Effective Date:   2007-03-18
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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