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产品更改通知

Change Notification #   16100
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Dpak Package Mold Compound Change – Discrete Products
Issue Date   2008-02-26
Affected Product Family  
Description   This is a Final Product Change Notice for a Mold Compound change previously announced in IPCN # 16041 issued on 30 August 2007. This FPCN is being issued only for Discrete (IGBTs, MOSFETs, Bipolar Transistors, Rectifier Diodes) products in the Dpak style package. All Qualification and Reliability testing has been completed and has passed all established criteria. As part of ON Semiconductor’s continuous improvement programs, the mold compound for the Dpak package assembled at the ON Semiconductor factory located at Seremban, Malaysia, will be changing. The same supplier of the existing compound will be used but the formulation will be modified for improved reliability in terms of moisture testing and delamination(SAT)performance.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2008-05-26
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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