产品更改通知
| Change Notification # |
|
16248 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of OSPI for Assembly and Final Test for SO8 Packages |
| Issue Date |
|
2009-04-15 |
| Affected Product Family |
|
|
| Description |
|
This is the Final PCN to Initial PCN 16173 located at www.onsemi.com announcing the successful completion of the qualification for the ON Semiconductor internal manufacturing site in Carmona, Philippines (OSPI) as an additional manufacturing site for SO-8 package assembly and final test.
There will be no changes in the wafer/die source. Device functionality will be unchanged. Device parameters will continue to meet all Data Book specifications and reliability will continue to meet or exceed ON Semiconductor standards.
This change is classified as capacity expansion. The products listed below can be manufactured at either OSPI or the existing facility, Unisem in Indonesia, once the final PCN expires.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-07-14 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|