产品更改通知
| Change Notification # |
|
16423 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Solder Die Attach replacing Epoxy Die Attach for SOT223 Package |
| Issue Date |
|
2010-03-03 |
| Affected Product Family |
|
|
| Description |
|
This is an addendum to FPCN16346 where ON Semiconductor is notifying customers of its plan to replace Epoxy Die Attach to Solder Die Attach for Bipolar Transistor used in SOT223-Epoxy package.
Product change to Solder Die Attach material in the SOT223 package can be rated as MSL-1 which dry packing is no longer required instead of the current MSL-3 rating with the epoxy. Additionally, Power Devices built with solder will have improved electrical and thermal conductivity over devices built with epoxy.
|
| Key Items Affected by Change |
|
Die Attach Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-06-03 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Masitah Aznam |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
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