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产品更改通知

Change Notification #   16427
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   TSSOP48 PACKAGE CONVERSION FROM BARE COPPER LEADFRAME TO PRE-PLATED LEADFRAME – ADDITIONAL LIST OF DEVICES
Issue Date   2010-03-03
Affected Product Family  
Description   This is the Final PCN located at www.onsemi.com announcing a change in lead frame from bare copper to Palladium Pre-plated leadframe for all the TSSOP48 package types, aligning with the other ON Semi TSSOP family devices. Device performance and reliability have not changed. There will be no changes to package dimensions, functionality, or data sheet specifications. This change will be effective for all the TSSOP48L products.
Key Items Affected by Change   ON Semiconductor Assembly and Test Site
 
Key Milestones  
Effective Date:   2010-06-03
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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