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产品更改通知

Change Notification #   16486
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   DPAK Package Case Outline Standardization to match JEDEC and Industry
Issue Date   2010-06-09
Affected Product Family  
Description   ON Semiconductor is updating our DPAK Package case outlines to follow the JEDEC TO-252 Solid State Product Outline dimensional methodology. There will be NO Change to any materials, processes, or physical dimensions in the manufacturing of the package, this is only a change to specifications dimensional methodology of the case outline. This updating of the package case outline does not affect the form/fit/function of devices as no changes to products are occurring.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2010-06-09
Sample Info:  
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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