产品更改通知
| Change Notification # |
|
16710 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Copper wire bond for Micro 8 package in Seremban, Malaysia |
| Issue Date |
|
2011-09-16 |
| Affected Product Family |
|
|
| Description |
|
A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wire bond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on the Micro 8 packages assembled at the Seremban, Malaysia assembly location. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles.
This update notice is to add one additional part number to the list of parts affected by the FPCN 16710 issued on 1 Sept 2011. The part number was accidentally missed in the original FPCN.
Please see FPCN # 16710 for information on Reliability Data and Changed Part identification.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2011-12-05 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Ahmad Taufek Md Noah |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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