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产品更改通知

Change Notification #   16710
Revision   A
Type of Notification   UPDATE NOTIFICATION
Change Title   Copper wire bond for Micro 8 package in Seremban, Malaysia – FPCN Cancelled
Issue Date   2012-02-29
Affected Product Family  
Description   The FPCN16710 was originally released on 1 Sept 2011 with an expiration date of 5-Dec-2011. This FPCN is now cancelled and the Micro 8 package will remain on the Gold Wire bond process. At some time in the future, a new FPCN may be issued to continue with this change.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2012-02-29
Sample Info:   Contact your local ON Semiconductor Sales Office or
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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