产品更改通知
| Change Notification # |
|
16862 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
SOIC-7/8, 14, 16 Lead Conversions from MSL3 to MSL1 |
| Issue Date |
|
2012-05-24 |
| Affected Product Family |
|
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| Description |
|
Through continuous process improvement of our SOIC assembly line, ON Semiconductor would like to announce that it will be changing the Moisture Sensitivity Level for those products listed in this Product Bulletin from MSL3 to MSL1. This means that the product listed in this product bulletin will no longer be shipped in dry packing materials. There has been no change in the BOM material set to achieve this higher MSL rating, only improvements to the assembly process.
|
| Key Items Affected by Change |
|
Assembly Process Moisture Sensitivity Level (MSL) |
| |
| Key Milestones |
|
| Effective Date: |
|
2012-05-24 |
| Sample Info: |
|
Contact your local ON Semiconductor sales office or |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|