feedback
评价本网页


需要帮助?


产品更改通知

Change Notification #   16862
Revision   A
Type of Notification   PRODUCT BULLETIN
Change Title   SOIC-7/8, 14 Lead Conversions from MSL3 to MSL1
Issue Date   2012-11-07
Affected Product Family  
Description   Through continuous process improvement of our SOIC assembly line, ON Semiconductor would like to announce that it will be changing the Moisture Sensitivity Level for those products listed in this Bulletin from MSL3 to MSL1. This means that the product listed in this product bulletin will no longer be shipped in dry packing materials. There has been no change in the BOM material set to achieve this higher MSL rating, only improvements to the assembly process.
Key Items Affected by Change   Assembly Process Moisture Sensitivity Level (MSL)
 
Key Milestones  
Effective Date:   2012-11-12
Sample Info:   Contact your local ON Semiconductor sales office or
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

之前浏览的产品
清除列表

技术支援
   
 

登记以获PCN(产品更改通知)最新信息!
  安森美半导体与PCNAlert合作,提供产品更改通知与更新通知。这服务能自动并及时通知有关产品更改和过时的信息。您可根据个人所需进行定制,方便您只收到您指定产品的产品更改通知(PCN)。

此服务由安森美半导体与PCNAlert免费为您提供。