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Change Notification #   16441
Revision  
Type of Notification   UPDATE NOTIFICATION
Change Title   Early Supply of Automotive Devices from NCP300/ 301/ 302/ 303 Families from Qualified Gresham Wafer Fab
Issue Date   2013-02-13
Affected Product Family  
Description   ON Semiconductor announced a capacity expansion qualification for the NCP300, NCP301, NCP302 & NCP303 product families, in July 2012 via FPCN 16441A. These device families were originally qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and are now qualified at ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. ON Semiconductor would like to inform our automotive customers that the silicon from Aizu Fab for NCV30x & SCV30x devices has been fully consumed, and effective March 7, 2013, the NCV30x devices will be supplied by Gresham Fab. ON Semiconductor requests that customers using SCV30x devices transition to the fully qualified, equivalent NCP30x or NCV30x device sourced from GSH Fab.
Key Items Affected by Change   Wafer Fab Location
 
Key Milestones  
Effective Date:   2013-03-07
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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