产品更改通知
| Change Notification # |
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20092 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of UTAC Singapore for Bump Post-Test Production |
| Issue Date |
|
2013-05-30 |
| Affected Product Family |
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| Description |
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ON Semiconductor is pleased to announce a capacity expansion qualification of UTAC, located in Singapore, as an additional source for bump product post-test operations (wafer saw, visual inspection, tape and reel). These operations are currently performed at the ON Semiconductor facility located in Seremban, Malaysia. Upon expiration (or approval) of this FPCN, these operations may be performed at the ON Semiconductor, Malaysia facility or at the UTAC facility in Singapore.
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| Key Items Affected by Change |
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| Key Milestones |
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| Effective Date: |
|
2013-08-31 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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