产品更改通知
| Change Notification # |
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20185 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
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Qualification of Deca Technologies Philippines for Bump Processing |
| Issue Date |
|
2013-08-20 |
| Affected Product Family |
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| Description |
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ON Semiconductor is pleased to announce a capacity expansion qualification of Deca Technologies, located in Laguna, Philippines, as an additional source for bump processing. Bump processing is currently performed at Flip Chip International, located in Phoenix, Arizona. Upon expiration (or early customer approval), bump processing may occur at either Deca Technologies or Flip Chip International.
Deca is certified to be compliant to ISO-9001 and ISO-14001.
All other process steps (wafer fab, test, tape and reel) will continue to occur in existing qualified locations. No changes to these process steps or locations are being made.
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| Key Items Affected by Change |
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| Key Milestones |
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| Effective Date: |
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2013-11-20 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
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N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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