产品更改通知
| Change Notification # |
|
20456 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper Wire for DFN/QFN packages for Power Solution products |
| Issue Date |
|
2014-04-29 |
| Affected Product Family |
|
|
| Description |
|
Referencing to the General Announcement # GA 16200: Conversion of Gold Wire to Copper Wire in ON Semiconductor’s Assembly Facilities, this is a Final Process Change Notification notifying customers of ON Semiconductor that Power Solution products built in DFN/QFN packages are now qualified to use Copper Wire BOM at their Manufacturing Assembly facility.
The affected products are represented by this Process Change Notice. At the expiration of this PCN, ON Semiconductor will build the affected products using Copper Wire BOM.
Reliability Qualification and Full Electrical Characterization over temperatures have been performed.
|
| Key Items Affected by Change |
|
ON Semiconductor Manufacturing Assembly |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-07-29 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|