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Change Notification #   20640
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   NCP6343 Wafer Probe ATE Qualification at UTAC and CSP Bump Qualification at FCI.
Issue Date   2014-09-15
Affected Product Family  
Description   This PCN is to notify ON Semiconductor’s customer’s that the NCP6343 family of devices are now qualified at UTAC (Singapore) for ATE wafer probing and CSP bumping at FCI (Phoenix, AZ, USA). The affected devices listed on this PCN are currently bumped at Deca (Philippines) and ATE wafer probed at ON Semiconductor Seremban, Malaysia facility (SBN). Upon expiration of this FPCN, or early customer approval, these devices may be processed at either Deca or FCI for CSP wafer bumping and SBN or UTAC for ATE wafer probing
Key Items Affected by Change   Assembly Site
 
Key Milestones  
Effective Date:   2015-01-05
Sample Info:   Contact your local ON Semiconductor Sales Office or Mat Hilton
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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