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产品更改通知

Change Notification #   16200
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Phase 2 Copper Wire for VHVIC Products in SOIC and TSSOP packages in OSPI
Issue Date   2015-01-13
Affected Product Family  
Description   A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wirebond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippine assembly location for the VHVIC products listed in this announcement. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2015-04-20
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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