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Change Notification #   4887
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   14/16/20L TSSOP 3-Layer Pre-Plated Frames
Issue Date   1999-07-28
Affected Product Family   DISCRETES AND LOGIC
Description   TSSOP products are being assembled using 2-layer (Ni-Pd) pre-plated lead frames or Sn-Pb from other assembly sites. Although no issue is being encountered in using the Sn-Pb or 2-layer PPF lead frames, a 3-layer PPF lead frame will further improve the process capability of the assembly line. In addition, this change will also create better wettability at the reflow process. Motorola Philippines at Carmona has qualified a 3-layer (Ni-Pd-Au) pre-plated lead frame for all the above packages. The required reliability tests results were very satisfactory.
Key Items Affected by Change   Assembly Process Package Change
 
Key Milestones  
Effective Date:   1999-11-05
Sample Info:  
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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