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LMV931 单和 LMV932 双是 CMOS 低压运算放大器,可使用具有轨对轨输入和输出摆幅的单侧电源(1.8 V 至 5.0 V)运行。两种器件都采用最新的小型封装,并且需要非常低的静态电流,因此非常适合电池供电的便携式应用,例如笔记本电脑和手持式仪器。轨对轨运行具有更高的信噪比性能,而小型封装允许更靠近信号源放置,从而减少了噪声拾取。单 LMV931 采用节省空间的 SC70-5 封装。双 LMV932 采用 Micro8 封装。这些小型封装对于拥挤的 PCB 非常有用。通过在 LMV981 单和 LMV982 双中增加关断功能,可以进一步降低功耗。其他所有功能和性能都相同。关断可通过将 SHDN 引脚驱动为低电平来实现。
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Rail to Rail
Channels
VS Min (V)
VS Max (V)
Iq Typ (mA)
VOS Max (mV)
GBW Typ (MHz)
SR Typ (V/µs)
IO Typ (mA)
ΔVOS/ΔT (μV/C)
eN (nV/√Hz)
Ibias Typ (pA)
CMRR Typ (dB)
Architecture
Temperature Range (°C)
Reference Price
LMV931SN3T1G
Active
Pb
A
H
P
TSOP-5 / SOT-23-5
1
260
REEL
3000
Y
Input/Output
1
1.8
5
0.075
6
1.4
0.48
80
5.5
50
1
70
CMOS
-40 to 125
$0.08
More Details
LMV931SQ3T2G
Active
Pb
A
H
P
SC-88A / SC-70-5
1
260
REEL
3000
Y
Input/Output
1
1.8
5
0.075
6
1.4
0.48
80
5.5
50
1
70
CMOS
-40 to 125
$0.0685
More Details
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可靠性数据
Die Related Summary Data
Device: LMV931SN3T1G
Equivalent to wafer fab process: ONC25
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
ONC25
1
2712519294
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)