肖特基功率整流器,表面贴装,0.5 A,20 V

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肖特基整流器运用肖特基势垒原理,采用势垒金属,可产生优化的正向压降-逆向电流权衡。该器件适用于低电压、高频率整流,或采用表面贴装的续流和极性保护二极管的应用,其中紧凑的尺寸和重量对系统至关重要。此封装提供了无引线 34 MELF 样式封装的替代方式。

  • Guardring for Stress Protection
  • Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25 C)
  • 125 C Operating Junction Temperature
  • Epoxy Meets UL94, VO at 1/8"
  • Package Designed for Optimal Automated Board Assembly

    Mechanical Characteristics
  • Reel Options:
    MBR0520LT1 = 3,000 per 7" reel/8 mm tape.
    MBR0520LT3 = 10,000 per 13" reel/8 mm tape.
  • Device Marking: B2
  • Polarity Designator: Cathode Band
  • Weight: 11.7 mg (approximately)
  • Case: Epoxy, Molded
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds
  • All Packages are Pb-Free
  • SBR8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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Package Type

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MSL Type

MSL Temp (°C)

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Container Qty.

ON Target

Configuration

VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

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Reference Price

MBR0520LT3

CAD Model

Pb

A

H

P

SOD-123

1

235

REEL

10000

N

Single

20

0.385

250

0.5

5.5

-

-

Price N/A

More Details

MBR0520LT3G

Active

CAD Model

Pb

A

H

P

SOD-123

1

260

REEL

10000

N

Single

20

0.385

250

0.5

5.5

-

-

$0.0441

More Details

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