150 V,30 A H 串联双肖特基整流器

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概览

增强型肖特基势垒整流器,VF 更低,浪涌能力更高,IR 参数更低

  • Power Supply - Output Rectification
  • Power Management
  • Instrumentation

  • Power Supply

  • Low Forward Voltage
  • Low Power Loss/High Efficiency
  • High Surge Capability
  • 30 A Total (15 A Per Diode Leg)
  • Guard-Ring for Stress Protection
  • These are Pb-Free Devices


    Mechanical Characteristics:
  • Case: Epoxy, Molded
  • Epoxy Meets UL 94 V-0 @ 0.125 in
  • Weight (Approximately): 1.9 Grams (TO-220 & TO-220FP)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds

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CAD Models

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Configuration

VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

Cj Max (pF)

Reference Price

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CAD Model

Pb

A

H

P

TO-220-3

NA

0

TUBE

50

N

Common Cathode

150

0.73

60

30

200

-

-

Price N/A

More Details

MBRF30H150CTG

Obsolete

CAD Model

Pb

A

H

P

TO-220-3 FullPak

NA

0

TUBE

50

N

Common Cathode

150

0.73

60

30

200

-

-

Price N/A

More Details

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