Schottky Diodes & Schottky Rectifiers | MBRM110L

肖特基功率整流器，表面贴装，1.0 A，10 V

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POWERMITE®Power 表面贴装封装 此款肖特基 Powermite 运用肖特基势垒原理，采用势垒金属和外延结构，可产生优化的正向压降-反向电流权衡。这种先进的封装技术可用于实现高能效的微型、节省空间的表面贴装整流器。由于其独特的散热设计，Powermite 具有与 SMA 相同的热性能，而占位减小 50%，高度外形 < 1.1 mm，是业内高度外形最小的整流器之一。由于其尺寸小巧，因而适用于蜂窝电话和无绳电话、充电器、笔记本电脑、打印机、PDA 和 PCMCIA 卡等便携式和电池供电产品。典型应用为 AC-DC 和 DC-DC 转换器、逆向电池保护和多个供应电压的“OR”运行，以及性能和尺寸性能至关重要的其他应用。

  • Ultra Low VF
  • 1st in Marketplace with a 10 VR Schottky Rectifier
  • Low Profile - Maximum Height of 1.1 mm
  • Small Footprint - Footprint Area of 8.45 mm2
  • Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
  • ESD Protection: Human Body Model >4000 V (Class 3)
    Machine Model >400 V (Class C)

    Mechanical Characteristics:
  • Powermite is JEDEC Registered as D0?216AA
  • Case: Molded Epoxy
  • Epoxy Meets UL 94V-O at 1/8 inch
  • Weight: 62 mg (approximately)
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds
  • Pb-Free Packages are Available
  • AEC-Q101 Qualified and PPAP Capable
  • NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

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MBRM110LT1

Contact Sales

Obsolete

CAD Model

Pb

A

H

P

POWERMITE-2

457-04

1

235

REEL

3000

N

Single

10

0.365

500

1

50

-

-

Price N/A

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MBRM110LT1G

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Last Shipments

CAD Model

Pb

A

H

P

POWERMITE-2

457-04

1

260

REEL

3000

N

Single

10

0.365

500

1

50

-

-

-

Price N/A

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MBRM110LT3

Contact Sales

Obsolete

CAD Model

Pb

A

H

P

POWERMITE-2

457-04

1

235

REEL

12000

N

Single

10

0.365

500

1

50

-

-

Price N/A

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MBRM110LT3G

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Obsolete

CAD Model

Pb

A

H

P

POWERMITE-2

457-04

1

260

REEL

12000

N

Single

10

0.365

500

1

50

-

-

-

Price N/A

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NRVBM110LT3G

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Obsolete

CAD Model

Pb

A

H

P

POWERMITE-2

457-04

1

260

REEL

12000

N

Single

10

0.365

500

1

50

-

-

Price N/A

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可靠性数据

Die Related Summary Data

Device: MBRM110LT1G

Equivalent to wafer fab process: RECT

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

3

19108175705

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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