方案
By Technology
该肖特基整流器运用肖特基势垒原理,采用势垒金属和外延结构,可产生优化的正向压降-逆向电流权衡。这种先进的封装技术可用于实现高能效的微型、节省空间的表面贴装整流器。由于其独特的散热设计,该整流器与 SMA 具有相同的热性能,而占位减小 50%,提供了业内最小高度的外形,不到 1.1 mm。由于其尺寸小巧,适用于蜂窝电话和无绳电话、充电器、笔记本电脑、打印机、PDA 和 PCMCIA 卡等便携式电池供电产品。典型应用为 AC-DC 和 DC-DC 转换器、逆向电池保护和多个供应电压的“OR”操作,以及性能和尺寸性能至关重要的其他应用。
搜寻
Close Search
产品:
4
分享
排序方式
产品系列:
┗
可订购器件:
4
产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Configuration
VRRM Min (V)
VF Max (V)
IRM Max (µA)
IO(rec) Max (A)
IFSM Max (A)
trr Max (ns)
Cj Max (pF)
Reference Price
More Details
MBRM140T1G
More Details
More Details
MBRM140T3G
More Details
Show More
1-25 of 25
Products per page
Jump to :
Find and compare products, get support and connect with onsemi sales team.
Contact Sales
分享
导出
Rows
Printer Friendly Version
PDF Format
Excel Format
CSV Format
To proceed order you need to accept Terms
可靠性数据
Die Related Summary Data
Device: MBRM140T1G
Equivalent to wafer fab process: RECT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RECT
3
19108175705
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)