MC14094B 组合了 8 级移位寄存器,每级都带有一个数据锁存,每个锁存有一个三态输出。数据在正向时钟转换时进行移位,从第七级移位到两个串行输出。QS 输出数据用于高速级联系统。QS 输出数据在下一个负向时钟转换时发生移位,用于低速级联系统。来自移位寄存器每级的数据在选通输入的负向转换时进行锁存。选通处于高电平时,数据通过该锁存进行传播。八个数据锁存的输出由三态缓冲器控制,这些缓冲器由输出启用上的逻辑低电平置于高阻抗状态。
搜寻
Close Search
产品:
6
分享
排序方式
产品系列:
┗
可订购器件:
6
产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Type
Channels
VCC Min (V)
VCC Max (V)
tpd Max (ns)
IO Max (mA)
Reference Price
MC14094BDG
More Details
MC14094BDR2G
More Details
MC14094BDTR2G
More Details
More Details
NLV14094BDR2G
More Details
NLV14094BDTR2G
More Details
Show More
1-25 of 25
Products per page
Jump to :
Find and compare products, get support and connect with onsemi sales team.
Contact Sales
分享
导出
Rows
Printer Friendly Version
PDF Format
Excel Format
CSV Format
To proceed order you need to accept Terms
可靠性数据
Die Related Summary Data
Device: MC14094BDG
Equivalent to wafer fab process: CMOS STD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS STD
3
3597164517
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)